US 7,473,314 B2
Method for growing silicon single crystal
Shuichi Inami, Tokyo (Japan); Nobumitsu Takase, Tokyo (Japan); Yasuhiro Kogure, Tokyo (Japan); Ken Hamada, Tokyo (Japan); and Tsuyoshi Nakamura, Tokyo (Japan)
Assigned to Sumco Corporation, Tokyo (Japan)
Filed on Mar. 28, 2006, as Appl. No. 11/390,366.
Claims priority of provisional application 60/693944, filed on Jun. 27, 2005.
Claims priority of application No. 2005-179995 (JP), filed on Jun. 20, 2005.
Prior Publication US 2006/0283373 A1, Dec. 21, 2006
Int. Cl. C30B 15/20 (2006.01)
U.S. Cl. 117—20  [117/13; 117/19; 117/932] 8 Claims
OG exemplary drawing
 
1. A method for growing a silicon single crystal according to the Czochralski method, comprising:
applying a thermal stress to at least a portion of the silicon single crystal during crystal growth, and
using a gaseous substance containing hydrogen atoms as an atmospheric gas for growing the crystal,
wherein the thermal stress comprises 30 MPa or more.