| US 7,472,836 B2 | ||
| Method and structure for implementing secure multichip modules for encryption applications | ||
| Mukta G. Farooq, Hopewell Junction, N.Y. (US); Benjamin V. Fasano, New Windsor, N.Y. (US); Jason L. Frankel, Wappingers Falls, N.Y. (US); Harvey C. Hamel, Poughkeepsie, N.Y. (US); Suresh D. Kadakia, Poughkeepsie, N.Y. (US); David C. Long, Wappingers Falls, N.Y. (US); Frank L. Pompeo, Redding, Conn. (US); and Sudipta K. Ray, Wappingers Falls, N.Y. (US) | ||
| Assigned to International Business Machines Corporation, Armonk, N.Y. (US) | ||
| Filed on Jun. 26, 2007, as Appl. No. 11/768,312. | ||
| Application 11/768312 is a continuation of application No. 10/907761, filed on Apr. 14, 2005, granted, now 7,281,667. | ||
| Prior Publication US 2008/0000988 A1, Jan. 03, 2008 | ||
| This patent is subject to a terminal disclaimer. | ||
| Int. Cl. G06K 19/05 (2006.01) | ||
| U.S. Cl. 235—492 [235/487] | 5 Claims |
| 1. A method for forming a tamper resistant, integrated circuit (IC) module, the method comprising:
embedding a conductive grid structure within both a ceramic-based chip carrier and a ceramic based cap structure, said conductive
grid structure having a plurality of meandering lines disposed in an x-direction, a y-direction, and a z-direction;
attaching one or more integrated circuit chips to a top surface chip carrier; and
attaching the cap structure to the top surface of the chip carrier;
wherein said conductive grid structure is configured to determine an attempt to penetrate the IC module by detecting at least
one of a change in resistance and a change in capacitance of said conductive grid structure.
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