| US 7,472,818 B2 | ||
| Selective rework process and apparatus for surface mount components | ||
| Brian D. Chapman, Poughkeepsie, N.Y. (US); Mary A. Emmett, Poughkeepsie, N.Y. (US); Arden S. Lake, Poughkeepsie, N.Y. (US); Wai Mon Wa, Poughkeepsie, N.Y. (US); Nandu N. Ranadive, Wappingers Falls, N.Y. (US); Michael Variano, Huntersville, N.C. (US); and John P. Weir, Lagrangeville, N.Y. (US) | ||
| Assigned to International Business Machines Corporation, Armonk, N.Y. (US) | ||
| Filed on Apr. 28, 2006, as Appl. No. 11/414,030. | ||
| Prior Publication US 2007/0251981 A1, Nov. 01, 2007 | ||
| Int. Cl. B23K 1/018 (2006.01); B23K 28/00 (2006.01); B23K 1/20 (2006.01); B23K 1/00 (2006.01); B23K 5/22 (2006.01) | ||
| U.S. Cl. 228—191 [228/264; 228/13; 228/19] | 9 Claims |
| 1. A method for removing a Surface Mount Technology (SMT) module soldered to a circuit board, the method comprising:
centering an opening through a top shield member over an SMT module to be removed from the circuit board;
aligning an opening through a bottom shield member exposing the solder mount of the SMT module to be removed;
locating an intermediate shield member in the opening in said top shield member, said intermediate shield member extending
to the circuit board and surrounding the SMT module to be removed; and
engaging a spring loaded mechanism positioned over said intermediate shield member for gripping the SMT module to be removed,
said spring loaded mechanism applying removal force for removing the SMT module from the circuit board when heat is applied
causing the solder holding the SMT module to the circuit board to reflow.
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